What materials are available for the manufacture of HDI?

The HDI is made of the following materials:

copper foil: conductive graphic composition of the basic material

core board (Core) : the skeleton of the circuit board, used for the inner production of the Core board.

semi-cured sheet (Prepreg): multi-layer board production of indispensable material, the adhesive between the core plate and the core plate, at the same time plays the role of insulation.

solder resistance ink: on the board to prevent welding, insulation, corrosion and so on.

character ink: marking function.

surface treatment materials: including spray tin, gold, silver, OSP and so on.

The development of HDI multilayer technology in the next few years will focus on the following aspects: the conductive circuit width and spacing will be more subtle, the conduction hole will be more subtle, and the insulation layer of the substrate will be thinner.

This development trend gives two major problems to the substrate material manufacturing industry: how to ensure the insulation reliability and through-hole reliability of HDI multilayer plate under the condition of the continuous development of narrow spacing and microporosity; How to achieve a thinner high-performance CCL.

Based on the above description, it is about the reliability of the substrate material, which is a comprehensive reflection of heat resistance, ion migration resistance, moisture resistance, TCP resistance, dielectric property and substrate microprocessing, electroplating processing performance. The so-called correlation with resin is that epoxy resin should meet the requirements of 3 layers:

To achieve the desired properties of the resin.

To ensure that these properties are stable under a variety of conditions.

It should have good co-existence with other high performance resins, i.e. mutual solubility, or reactivity, or polymer alloying.