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High Frequency PCB Process Capabilities



Items

Process Capabilities

Layers

1-10

Base materals

FR-4, High-frequency

Maximum size

450mm×600mm

Dimension accuracy

±0.10mm

Thickness range

0.40-5.00mm

Thickness tolerance(THK≥0.8mm)

±10%

Thickness tolerance(THK<0.8mm)

±10%

Dielectric thickness

0.07-1.50mm

Minimum line width

0.1mm

Minimum space

0.1mm

Outer copper thickness

35-105um

Inner copper thickness

17-75um

Drill hole(Mechanical)

0.2-6.35mm

Finished hole(Mechanical)

0.15-6.30mm

Diameter tolerance(Mechanical)

±0.075mm

Hole position tolerance(Mechanical)

±0.05mm

Aspect ratio

10:01

Solder mask type

LPI

Minimum solder mask bridge width

0.1mm

Minimum solder mask clearance

0.075mm

Plug hole diameter

0.20-0.50mm

Impedance control tolerance

±10%

Surface finish

HASL, LF-HASL, ENIG, Imm Tin, Imm Ag, OSP, Gold Finger






Production Time


Layers

Process Time

2 Layer High Frequency PCB

+3 days

Multilayer High Frequency PCB

+5 days

Blind Via High Frequency PCB

+6 days