Material type | Model | Filling Material | Dk(@10GHZ) | Df(@10GHZ) |
F4B-1/2 | PTFE+Glass cloth | 2.55/2.65 | ≤0.001 | |
F4BK | F4BK225 | PTFE+Glass cloth | 2.55 | ≤0.001 |
F4BK265 | PTFE+Glass cloth | 2.65 | ≤0.001 | |
F4BK300 | PTFE+Glass cloth | 3 | ≤0.001 | |
F4BK350 | PTFE+Glass cloth | 3.5 | ≤0.001 | |
F4BM | F4BM220 | PTFE+Glass cloth | 2.2 | ≤0.007 |
F4BM225 | PTFE+Glass cloth | 2.55 | ≤0.007 | |
F4BM265 | PTFE+Glass cloth | 2.65 | ≤0.007 | |
F4BM300 | PTFE+Glass cloth | 3 | ≤0.007 | |
F4BM350 | PTFE+Glass cloth | 3.5 | ≤0.007 |
In the design of high-frequency PCB, designers usually pay more attention to the dielectric constant (DK) and tangent loss (DF) of PCB when selecting materials, and only pay attention to the thickness of copper foil when selecting copper foil, which is easy to ignore the influence of different types of copper foil roughness on the electrical properties of products.
SEM analysis of the micro morphology of different types of copper foil and dielectric contact surface shows that the roughness of different types of copper foil is quite different. In the design of microstrip line, the roughness of copper foil and dielectric contact surface will directly affect the insertion loss of the whole transmission line.