Items | Process Capabilities |
Layers | 1-10 |
Base materals | FR-4, High-frequency |
Maximum size | 450mm×600mm |
Dimension accuracy | ±0.10mm |
Thickness range | 0.40-5.00mm |
Thickness tolerance(THK≥0.8mm) | ±10% |
Thickness tolerance(THK<0.8mm) | ±10% |
Dielectric thickness | 0.07-1.50mm |
Minimum line width | 0.1mm |
Minimum space | 0.1mm |
Outer copper thickness | 35-105um |
Inner copper thickness | 17-75um |
Drill hole(Mechanical) | 0.2-6.35mm |
Finished hole(Mechanical) | 0.15-6.30mm |
Diameter tolerance(Mechanical) | ±0.075mm |
Hole position tolerance(Mechanical) | ±0.05mm |
Aspect ratio | 10:01 |
Solder mask type | LPI |
Minimum solder mask bridge width | 0.1mm |
Minimum solder mask clearance | 0.075mm |
Plug hole diameter | 0.20-0.50mm |
Impedance control tolerance | ±10% |
Surface finish | HASL, LF-HASL, ENIG, Imm Tin, Imm Ag, OSP, Gold Finger |
Layers | Process Time |
2 Layer High Frequency PCB | +3 days |
Multilayer High Frequency PCB | +5 days |
Blind Via High Frequency PCB | +6 days |