6 Layer Rogers 4350+FR4 Mixed Lamination PCB

The Difficulty Of Laminated Structure Of Mixed Lamination PCB

One of the major challenges in RF/microwave applications is how to ensure that the actual tolerances are within the design tolerances, so as to achieve the desired operating frequency. One of the biggest challenges in the lamination design of mixed-pressure structures is to have uniform thickness between different panels or even between different pieces. Due to the existence of a variety of substrate material types, there are a variety of semi-cured sheet types.

Rogers is different from traditional PCB epoxy resin. There is no glass fiber in the middle and it is a ceramic based high frequency material. At circuit frequencies above 500MHz, the range of materials available to the design engineer is greatly reduced. Rogers RO4350B material can be easily made RF engineering design circuits, such as network matching, transmission line impedance control, etc. Due to its low dielectric loss, R04350B has an advantage over common circuit materials in high frequency applications. The dielectric constant of temperature fluctuation is almost the lowest in the same material. The permittivity is also remarkably stable at 3.48 over a wide frequency range. 3.66. Lopra copper foil design recommendations to reduce insertion loss. This makes the material suitable for broadband applications.

Advantages Of Mixed Lamination PCB

With the development of electronics and communication industry, high-frequency circuit and RF (radio frequency) design is more and more widely, more and more high frequency boards are used in PCB to meet the requirements of signal transmission.

However, due to the relatively high price of hf board, from the point of view of cost saving, PCB structure design usually adopts mixed pressure. This is when Rogers hybrid laminated PCBS appeared. That is, in addition to the necessary signal layer using high frequency copper cladding plate to meet the requirements of signal transmission rate, signal integrity and impedance matching, other layers still use conventional FR-4 copper cladding plate, and FR-4 copper cladding plate mixed with high frequency copper cladding plate, but the higher the signal frequency, the higher the additional line loss.

1. High-frequency PCB has high density and improved signal. It offers a frequency range from 500MHz to 2GHz, ideal for high-speed designs.

2. The use of the ground layer further improves the signal quality and reduces the electromagnetic wave.

3. Reduce circuit impedance and provide shielding effect

4. By reducing the distance between the plane and the routing layer, crosstalk can be avoided